INSIDE YOUR SMARTPHONE
Mobile chips
Explore chip generations, manufacturing processes and CPU specifications.
MediaTek Dimensity 6400 TurboMediaTek
· 2026
· 6 nm
· 8 cores
MediaTek Dimensity 7300 MaxMediaTek
· 2026
· 4 nm
· 8 cores
MediaTek Dimensity 7450XMediaTek
· 2026
· 4 nm
· 8 cores
MediaTek Dimensity 8500 ExtremeMediaTek
· 2026
· 4 nm
· 8 cores
HiSilicon Kirin 9030SHiSilicon
· 2026
· 5 nm
· 8 cores
MediaTek Dimensity 7100 EliteMediaTek
· 2026
· 6 nm
· 8 cores
Qualcomm Snapdragon 6 Gen 5Qualcomm
· 2026
· 4 nm
· 8 cores
Qualcomm Snapdragon 8 Elite Gen 5 V SeriesQualcomm
· 2026
· 3 nm
· 8 cores
MediaTek Dimensity 9500sMediaTek
· 2026
· 3 nm
· 8 cores
MediaTek Dimensity 8500-UltraMediaTek
· 2026
· 4 nm
· 8 cores
MediaTek Helio G99+MediaTek
· 2026
· 6 nm
· 8 cores
Samsung Exynos 1610Samsung
· 2026
· 8 cores
Samsung Exynos 1680Samsung
· 2026
· 4 nm
· 8 cores
MediaTek Dimensity 8550MediaTek
· 2026
· 8 cores
Apple A20 ProApple
· 2026
· 2 nm
· 6 cores
MediaTek Dimensity 6400 MaxMediaTek
· 2025
· 6 nm
· 8 cores
MediaTek Dimensity 7300+MediaTek
· 2025
· 4 nm
· 8 cores
MediaTek Dimensity 8350 UltraMediaTek
· 2025
· 4 nm
· 8 cores
MediaTek Dimensity 8400 MaxMediaTek
· 2025
· 4 nm
· 8 cores
MediaTek Dimensity 9400eMediaTek
· 2025
· 4 nm
· 8 cores
Qualcomm Snapdragon 8 Gen 5Qualcomm
· 2025
· 3 nm
· 8 cores
MediaTek Dimensity 6400MediaTek
· 2025
· 6 nm
· 8 cores
MediaTek Dimensity 7060MediaTek
· 2025
· 6 nm
· 8 cores
Qualcomm QCM6690 (Dragonwing Q-6690)Qualcomm
· 2025
· 4 nm
· 8 cores
UNISOC T8100UNISOC
· 2025
· 6 nm
· 8 cores
UNISOC T7100UNISOC
· 2025
· 8 cores
UNISOC T7255UNISOC
· 2025
· 12 nm
· 8 cores
MediaTek Dimensity 7400XMediaTek
· 2025
· 4 nm
· 8 cores
MediaTek Helio G200MediaTek
· 2025
· 6 nm
· 8 cores
MediaTek Dimensity 7100MediaTek
· 2025
· 6 nm
· 8 cores